SEMI E182 - Specification for Panel FOUP Loadport for Panel Level Packaging -

Abstract

The purpose of this Specification is to define the basic interface dimensions of a load port on the semiconductor manufacturing equipment (SME), where a Panel FOUP can be loaded and unloaded. The intention of this Specification is to define a set of requirements and features to enable interoperability of load ports and Panel FOUPs without limiting innovative solutions.

Since the interface specification in this Standard is driven by and intended to mate with a Panel FOUP compliant to the relevant SEMI Panel FOUP Standards, individual dimensions related to panel size are specified by the applicable Subordinate Standard of this Primary Standard.

Loading and unloading is assumed to take place in semi-automated and automated mode by using appropriate system or device (e.g., person guided vehicle or overhead hoist vehicle).

Subordinate Standards (included)

SEMI E182.1-0621 (Reapproved 0723) — Specification for Panel FOUP Loadport for 510 to 515 mm Panel Size

SEMI E182.2-0621 (Reapproved 0723) — Specification for Panel FOUP Loadport for 600 to 600 mm Panel Size

Referenced SEMI Standards (purchase separately)

None.

Revision History

SEMI E182-0723 (technical revision)

SEMI E182-0621 (first published)

SEMI E182.1-0621 (Reapproved 0723)

SEMI E182.1-0621 (first published)

SEMI E182.2-0621 (Reapproved 0723)

SEMI E182.2-0621 (first published)

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