{"title":"SEMI Certifications","description":"","products":[{"product_id":"semiconductor-technician-certification","title":"Semiconductor Technician Certification","description":"\u003cp\u003e\u003cstrong\u003eCurriculum Description \u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eSemiconductors are the basic building blocks of today's modern world. This curriculum has been designed to equip learners with the necessary skills to excel in a semiconductor manufacturing environment.  The curriculum consists of twenty-two courses that provide a comprehensive understanding of the semiconductor manufacturing process.  \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eAt the end of the training, the learner will be able to enroll in a certification exam. This exam will consist of 100 questions. The learner will have three attempts to pass the exam. A passing score of 75% is required.  If you do not pass the test after three attempts, you will be required to re-enroll in the curriculum.  This certification is valid for a period of three years and is issued by SEMI in cooperation with our partner Workforge.  \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCurriculum Objectives \u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eSummarizes a high-level overview of the steps that are taken to build a semiconductor. \u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eIdentifies the methods used to deposit thin films onto a wafer, or substrate.\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eExplains the ion implantation overview process.\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eReviews the general process of performing a vacuum leak check.\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003ePerforms a vacuum leak check. \u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eTopics Covered\u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eElectromagnetic Devices\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eHand tools for Electrical Wiring\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eElectrical Measurement and Unit Conversion\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eElectrical Resistance Test Equipment\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eThe Fluke\u003cspan style=\"background-color:rgb(237,245,253);color:rgb(54,54,78);font-size:14px;\"\u003e\u003cspan style='-webkit-text-stroke-width:0px;display:inline !important;float:none;font-family:\"Source Sans Pro\", Arial, sans-serif;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e® \u003c\/span\u003e\u003c\/span\u003e Multimeter\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eAtomic Structure\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eElectrical Circuits\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eElectrical Current\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eElectrical Power\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eOhm's\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eProduction of Electricity\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eResistance\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eTransmission and Distribution of Electricity\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eUses of Electricity\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eVoltage\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eWatt's Law\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eIon Implantation\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eThin Films\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eSemiconductor Process Overview\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eVacuum Leak Checking\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eVacuum Leak Checking Gamification\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eSolid State Devices\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCurriculum Duration\u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e40+ hours, Certification exam 1.5 hours\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eNew hires, managers, supervisors, engineers, technicians, or any individual working in semiconductor manufacturing \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/p\u003e\u003cp line-height:=\"\"\u003eNone\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e","brand":"Workforge","offers":[{"title":"Default Title","offer_id":43965704470706,"sku":"17504","price":999.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0121\/9441\/4651\/files\/2048x2048SU_Semiconductor_TechCert_v2_2x_df5b8a8a-87fe-4836-8f31-71e414404869.png?v=1712849644"},{"product_id":"pneumatics-hydraulics-technician-certification","title":"Pneumatics\/Hydraulics Technician Certification","description":"\u003cp\u003e\u003cstrong\u003eCurriculum Description \u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eVacuum technology has played a crucial role in semiconductor manufacturing and has been essential in early applications including light bulbs, radios, amplifiers that contained vacuum tubes, and televisions with CRT picture tubes. The vacuum-based processes in semiconductor manufacturing ensure high levels of precision and quality.  components used in advanced semiconductor processes such as MEMS sensors, high-resolution LCD\/LED screens, and Li-ion batteries rely on vacuum processes. \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eThis curriculum will also introduce the learner to hydraulic systems and their components and explain the purposes of hydraulic actuators. It will also compare hydraulic and pneumatic systems. The learner will also be able to explain the types and purposes of hydraulic actuators.  This certification will cover ten courses. \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eAt the end of the training, the learner can enroll in the certification exam. This exam will consist of 100 questions. The learner will have three attempts to pass the exam. A passing score of 75% is required.  If you do not pass the test after three attempts, you must re-enroll in the curriculum.  This certification is valid for three years and is issued by SEMI in cooperation with our partner Workforge.  \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCurriculum Objectives \u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eUnderstand the laws of hydraulics. \u003c\/li\u003e\n\u003cli\u003eList the types of hydraulic fluids.\u003c\/li\u003e\n\u003cli\u003eDefine hydraulics and list the differences between hydrostatic and hydrodynamic systems.\u003c\/li\u003e\n\u003cli\u003eList vacuum types.  \u003c\/li\u003e\n\u003cli\u003eExplain the properties of gases and vacuums.\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eTopics\u003c\/strong\u003e \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eVacuum Technology\u003c\/li\u003e\n\u003cli\u003eThe Properties of Gases\u003c\/li\u003e\n\u003cli\u003eIntroduction to Hydraulics\u003c\/li\u003e\n\u003cli\u003eHydraulic Theory\u003c\/li\u003e\n\u003cli\u003eHydraulic Fluids\u003c\/li\u003e\n\u003cli\u003eHydraulic Systems\u003c\/li\u003e\n\u003cli\u003eHydraulic Actuators\u003c\/li\u003e\n\u003cli\u003eClassification of Hydraulic Valves\u003c\/li\u003e\n\u003cli\u003eHydraulic Piping and Instrumentation\u003c\/li\u003e\n\u003cli\u003eHydroelectric Symbology and Circuits\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCurriculum Duration\u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e20+ hours, Certification exam 1.5 hours\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eNew hires, managers, supervisors, engineers, technicians, or any individual working in semiconductor manufacturing \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/p\u003e\u003cp line-height:=\"\"\u003eNone\u003c\/p\u003e","brand":"Workforge","offers":[{"title":"Default Title","offer_id":44121689391282,"sku":"17518","price":699.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0121\/9441\/4651\/files\/800x800_Shopify_SU_Pneumatics_Hydaulics_Cert_v1.png?v=1713975753"},{"product_id":"ic-packaging-beginner-certification","title":"IC Packaging - Beginner Level Certification","description":"\u003cdiv ccp_infra_version=\"3\" ccp_infra_timestamp=\"1716988392666\" ccp_infra_user_hash=\"1051031829\" ccp_infra_copy_id=\"1980f2d4-4af2-419b-9be3-c9f979c27198\" data-ccp-timestamp=\"1716988392666\"\u003e\n\u003cmeta http-equiv=\"Content-Type\" content=\"text\/html; charset=utf-8\"\u003e\n\u003cmeta name=\"ProgId\" content=\"Excel.Sheet\"\u003e\n\u003cmeta name=\"Generator\" content=\"Microsoft Excel 15\"\u003e\n\u003cstyle\u003etable\n\t{mso-displayed-decimal-separator:\"\\.\";\n\tmso-displayed-thousand-separator:\"\\,\";}\ntr\n\t{mso-height-source:auto;}\ncol\n\t{mso-width-source:auto;}\ntd\n\t{padding-top:1px;\n\tpadding-right:1px;\n\tpadding-left:1px;\n\tmso-ignore:padding;\n\tcolor:black;\n\tfont-size:11.0pt;\n\tfont-weight:400;\n\tfont-style:normal;\n\ttext-decoration:none;\n\tfont-family:Calibri, sans-serif;\n\tmso-font-charset:0;\n\ttext-align:general;\n\tvertical-align:bottom;\n\tborder:none;\n\twhite-space:nowrap;\n\tmso-rotate:0;}\n.xl17\n\t{white-space:normal;}\n\u003c\/style\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cbr\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Description \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eThe semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential. To address this increased potential of the semiconductor industry, this beginner’s level curriculum prepares learners for a career in semiconductor manufacturing with a focus on integrated chip (IC) packaging. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eIC Packaging requires interdisciplinary knowledge, such as mechanical, materials, chemical, and electronics engineering. This curriculum aims to bring things from this interdisciplinary lens by teaching foundational concepts, PCB, board assembly, soldering, and leadframe and substrate package assembly.  Engineers who complete this certification are more ready to take on issues they encounter in the field during the design and manufacturing operations. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eAt the end of the training, learners must complete the final exam to receive certification. This exam will consist of 100 questions. Learners have up to three attempts to pass the exam. A passing score of 75% is required.  If you do not pass the test after three attempts, you must re-enroll in the curriculum. This certification is valid for three years and is issued by SEMI. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\" id=\"isPasted\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eThe IC Packaging Beginner’s Certification includes 3 courses. \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eThese individual courses can be purchased separately, but this is the only bundle that includes a summative exam. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Objectives \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eSummarize introductory concepts of integrated chip packaging\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eExplain PCB, board assembly, and soldering functions and constituents\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eIdentify various assembly processes \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Duration\u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e3.5 hours, Certification exam 1.5 hours\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can take advantage of this curriculum to ensure their workforce is ready.\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eAt least some college-level scientific knowledge \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/div\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":44358811484338,"sku":"17571","price":299.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0121\/9441\/4651\/files\/semi_image_generator_4.webp?v=1758848281"},{"product_id":"ic-packaging-intermediate-certification","title":"IC Packaging - Intermediate Level Certification","description":"\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eIt's highly recommended that you complete the Beginner Level of IC Packaging Bundle and Certification Exam before registering for this course content.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCurriculum Description \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eThis intermediate-level curriculum is designed for engineers and professionals seeking a deeper understanding of integrated circuit (IC) packaging technologies. As the semiconductor industry continues to evolve and expand across sectors usch as consumer electronics, communications, automotive, and medical devices, mastering the intricacies of IC packaging becomes essential. This bundle includes four comprehensive courses that explore critical components and processes involved in IC packaging:\u003cstrong style=\"box-sizing:border-box;\"\u003e Interposers and Its Processes, Interconnects and Its Processes, Front-End Assembly Line Processes, and Back-End of Line Assembly Processes.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eBy completing this curriculum, learners will gain interdisciplinary knowledge spanning mechanical, materials, chemical, and electronics engineering, empowering them to address complex challenges in design and manufacturing operations.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eAt the end of the training, learners must complete the final exam to receive certification. This exam will consist of 100 questions. Learners have up to three attempts to pass the exam. A passing score of 75% is required. If you do not pass the test after three attempts, you must re-enroll in the curriculum. This certification is valid for three years and is issued by SEMI.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourses Included\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eInterposers and Its Processes \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eExplore the foundational role of Interposers in IC Packaging. This course covers various interposer types- leadframe, ceramic, silicon glass, rigid substrate, and flex-and their respective fabrication flows. Learners will understand the functions and development of interposers and how they influence packaging performance and reliability. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eFunctions of interposers\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eLeadframe and ceramic fabrication flows\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eSilicon and glass interposers\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eRigid and flex substrates\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eInterposer development processes\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eInterconnects and Its Processes\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eDive into the technologies that enable electrical connections within microelectronic packages. This course provides a comparative analysis of wirebonding, tape automated bonding (TAB), and flip chip technologies, highlighting their applications, advantages, and process flows. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eWirebonding technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eTape automated bonding (TAB)\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eFlip chip technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eComparative analysis of interconnect methods\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eFront of Line Assembly Processes\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eLearn about the front-of-line packaging assembly concepts such as key package assembly technologies of backgrinding, dicing, and die attach device. Their various processes, materials, and future direction to meet the semiconductor application needs. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eBackgrinding technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eDicing technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eDie attach technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eComparative analysis of interconnect methods\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eBack-End of Line Assembly Processes\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eGain insights into the final stages of IC packaging assembly. This course focuses on the assembly processes for wirebond leadframe and flip chip on substrate packages, including molding, underfilling, pating, ball attach,, and PCB assembly. Learners will explore the materials, process parameters, and reliability considerations essential for high-performance packaging.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eMolding technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eUnderfilling and encapsulants for flip chips\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003ePlating for leadframe\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eBall attach and intermetallic\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003ePCB Assembly  \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCurriculum Duration \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e4.5 hours, Certification exam 1.5 hours\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eThis curriculum is ideal for intermediate-level engineers, technicians, and professionals in the semiconductor packaging, manufacturing, and design roles who are looking to expand their technical expertise and stay ahead in a rapidly evolving industry. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eThe passing of the IC Packaging Beginner Level certification exam, OR a sufficient understanding of introductory concepts of IC Packaging, PCB board assembly, and soldering, and general assembly processes.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"box-sizing:border-box;margin-top:0px;\"\u003e \u003c\/p\u003e\n\u003c\/div\u003e\u003c\/div\u003e\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\n\u003cbr\u003e \u003c\/div\u003e","brand":"Dr. Lee Teck Kheng","offers":[{"title":"Default Title","offer_id":46157037043890,"sku":"18708","price":299.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0121\/9441\/4651\/files\/semi_image_generator_5_1b5e4a5c-76b1-4913-a1d9-03b826b6bbe9.webp?v=1758848308"}],"url":"https:\/\/store-us.semi.org\/collections\/semi-certifications.oembed","provider":"semi.org","version":"1.0","type":"link"}