SEMI M47 - CMOS LSI用シリコン・オン・インシュレーター(SOI)ウェーハのための仕様

Volume(s): Materials
Language: Japanese
Type: Single Standards Download (.pdf)
Abstract

本スタンダードは,global Silicon Wafer Committeeで技術的に承認されている。現版は2007年4月25日,global Audits and Reviews Subcommitteeにて発行が承認された。2007年6月にwww.semi.orgで,そして2007年7月にCD-ROMで入手可能となる。初版は2001年11月発行,前版は2004年7月に発行された。

 

本仕様は,CMOS大規模集積回路(LSI large scale integrated circuit)デバイス用の薄膜シリコン・オン・インシュレーター(SOI silicon-on-insulator)ウェーハの要求条件を規定するものである。本仕様は,別の面で,通常0.2 µm未満のSOI層厚を持つSIMOXおよび貼り合せSOIウェーハの一般特性を規定している。パラメータ,検査手順および受入基準を規定することにより,サプライヤと顧客双方が,製品の特性および品質要求条件を一貫して定義するのがよい。

 

Referenced SEMI Standards

SEMI M1 — Specifications for Polished Single Crystal Silicon Wafers
SEMI M18 — Guide for Developing Specification Forms for Order Entry of Silicon Wafers
SEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection
SEMI M41 — Specification of Silicon-on-Insulator (SOI) for Power Device/ICs
SEMI M53 — Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Polystyrene Latex Spheres on Unpatterned Semiconductor Wafer Surfaces
SEMI M59 — Terminology for Silicon Technology
SEMI MF26 — Test Methods for Determining the Orientation of a Semiconductive Single Crystal
SEMI MF42 — Test Methods for Conductivity Type of Extrinsic Semiconductor Materials
SEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe
SEMI MF523 — Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
SEMI MF928 — Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
SEMI MF1152 — Test Methods for Dimensions of Notches on Silicon Wafers
SEMI MF1188 — Test Method for Interstitial Oxygen Content of Silicon by Infrared Absorption with Short Baseline
SEMI MF1390 — Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1619 — Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with p-Polarized Radiation Incident at Brewster Angle
SEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers

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