{"product_id":"plasma-etching-ale-rie-us-eu-08-25-2026","title":"Plasma Etching, ALE \u0026 RIE US \u0026 EU 08\/25\/2026","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:center;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003ePlasma Etching, ALE \u0026amp; RIE\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:center;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003e2-day Training Webinar\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:center;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eAugust 25, 2026 - 1st Day: 8:00 - 12:00 PST\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:center;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eAugust 26, 2026  - 2nd Day: 8:00 - 12:00 PST\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eThis course discusses plasma-assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma\/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail, and the factors that influence the anisotropy of etching are highlighted. Plasma-assisted etching equipment is described, including capacitively coupled, inductively coupled, and wave-generated plasma sources.  \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eThe instructor discussed the applied aspects of plasma-assisted etching from a general point of view. The emphasis is on mechanistic understanding. The etching of Si and its compounds is covered in detail. The chemistries used in the etching of other technology-related materials, such as AI, organics, and III-V compounds, are summarized. Other topics presented include selectivity, loading, ARDE, and feature scale problems, damage, and issues associated with high-density plasma RIE. A section on plasma diagnostics and ion-beam-based etching methods is briefly discussed.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style='box-sizing:border-box;font-family:\"inherit\", serif;font-size:12pt;'\u003eLearning Objectives:\u003c\/span\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);display:revert;font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;list-style:revert;margin:revert;orphans:2;padding:0px 0px 0px revert;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eUnderstand the fundamentals of dry etching and the basic concepts of plasma etching.\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eUnderstand the physics of RF glow discharges (both high and low density.)\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eUnderstand the surface science aspects of RIE, including the role of energetic ions.\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eRecognize the factors that influence etching anisotropy.\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eDefine the steps of plasma-surface chemistry leading to etching.\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003e\u003cstrong style=\"box-sizing:border-box;font-style:inherit;font-weight:revert;\"\u003eCourse Topics\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);display:revert;font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;list-style:revert;margin:revert;orphans:2;padding:0px 0px 0px revert;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eFluorocarbon plasma etching of Si and its compounds\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eSelectivity, loading effects, and aspect ratio-dependent etching\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eUniformity of etching, damage, feature charging issues, and particles\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eEtching of other materials (AI, organics, III-V compounds, etc.)\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003ePlasma diagnostics such as optical emission spectroscopy with actinometry, mass spectrometry, and laser-induced fluorescence\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eIssues in high-density plasma etching, wall effects, and ion-beam-based methods\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eDeep Reactive Ion Etching (DRIE)\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eApplications and processing etching using ALE\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eEndpoint detection\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003e\u003cstrong style=\"box-sizing:border-box;font-style:inherit;font-weight:revert;\"\u003eWho should attend\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Aptos, sans-serif;font-size:12pt;\"\u003eThis course is intended for scientists, technicians, and others working or interested in the dry etching of materials in reactive gas glow discharges, particularly those who do not have extensive experience in the field.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:revert;orphans:2;padding:0px;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003e\u003cstrong style=\"box-sizing:border-box;font-style:inherit;font-weight:revert;\"\u003eCancellation and Rescheduling Policies   \u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(38, 38, 38);display:revert;font-family:Arial, Helvetica, sans-serif;font-size:13px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;list-style:revert;margin:revert;orphans:2;padding:0px 0px 0px revert;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\n\u003cli\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003eRegistrants may cancel or reschedule a class no less than 30 days before the class start date.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003eCancellations received after the stated deadline will not be eligible for a refund.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003eCancellations will be accepted via email to \u003c\/span\u003e\u003ca style=\"box-sizing:border-box;\" href=\"mailto:semiu-support@semi.org\"\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003esemiu-support@semi.org\u003c\/span\u003e\u003c\/a\u003e\n\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003eAll refund requests will be credited to the original payment method used for payment.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003eSEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class’s start date.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"box-sizing:border-box;font-family:Arial, sans-serif;font-size:11pt;\"\u003eIf SEMI cancels a class, the registrants will be offered a full refund. \u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":47548958802098,"sku":"21369","price":845.0,"currency_code":"USD","in_stock":true}],"url":"https:\/\/store-us.semi.org\/products\/plasma-etching-ale-rie-us-eu-08-25-2026","provider":"semi.org","version":"1.0","type":"link"}