{"product_id":"reshaping-moores-law-with-advanced-packaging-8-3-26","title":"Reshaping Moore's Law with Advanced Packaging 8\/3\/26","description":"\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003eReshaping Moore’s Law \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003e\u003cu\u003eDates \u0026amp; Times\u003c\/u\u003e\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003eAugust 3\u003csup\u003erd\u003c\/sup\u003e, 2026\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003e8:30 am – 5:00pm GMT +8  \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003e\u003cu\u003eLocation\u003c\/u\u003e\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003eVirtual\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003e\u003cu\u003ePricing\u003c\/u\u003e\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:#262626;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003eMembers: \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cspan style=\"background-color:white;color:#333333;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e$599\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;text-align:center;\"\u003e\u003cspan style=\"color:black;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:14.0pt;'\u003e\u003cstrong\u003eNon-Members:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cspan style=\"background-color:white;color:#333333;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e $649\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003eThis workshop explores how advanced packaging is redefining the trajectory of Moore's Law. Participants will gain insight into cutting-edge approaches, such as heterogeneous integration and chiplet architectures, that enable continued performance growth beyond traditional scaling limits. \u003c\/p\u003e\u003cp\u003eWe will delve into key packaging, including wafer-level packaging, fan-out wafer and panel-level solutions, 3D integration, and embedded packaging- highlighting how each enhances transistor density and system performance, along with the associated technical challenges. The session will also cover next-generation interconnect and bonding techniques, including thermocompression and hybrid bonding used in advanced die-stacking solutions such as SoIC-X and SoIC-P. \u003c\/p\u003e\u003cp\u003eIn addition, the workshop will examine evolving interposer architectures (2.1D, 2.3D, 2.5D, and beyond), including platforms such as CoWoS-S, CoWoS-L, and CoWoS-R. It will also explore emerging interposer materials like glass substrates, covering their benefits, fabrication processes, technical challenges, and supply chain landscape in supporting the continued evolution of Moore's Law.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWho Should Attend\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003eThis course is intended for both manufacturing and R\u0026amp;D know-how in IC packaging professionals, including but not limited to:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDirectors\u003c\/li\u003e\n\u003cli\u003eManagers\u003c\/li\u003e\n\u003cli\u003eProcess Engineers\u003c\/li\u003e\n\u003cli\u003eR\u0026amp;D Engineers\u003c\/li\u003e\n\u003cli\u003eSales and Application Engineers who supply packaging materials and tools\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003cstrong\u003eLearning Objectives\u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eUnderstand the principles in the evolution of IC packaging and how the semiconductor industry has evolved with time.\u003c\/li\u003e\n\u003cli\u003eUnderstand the principles of Interconnections ranging from TAB, and Wirebond to various Flip Chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R\u0026amp;D development.\u003c\/li\u003e\n\u003cli\u003eReview the interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging.\u003c\/li\u003e\n\u003cli\u003eExplain the assembly flow and new assembly techniques from backgrinding to singulation.\u003c\/li\u003e\n\u003cli\u003eDescribe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003cstrong\u003eCourse Topics\u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eAdvanced packaging and material characterization.\u003c\/li\u003e\n\u003cli\u003ePackaging principles and how packaging evolves into heterogeneous packaging.\u003c\/li\u003e\n\u003cli\u003ePackaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.\u003c\/li\u003e\n\u003cli\u003eWirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.\u003c\/li\u003e\n\u003cli\u003eAssembly processes from backgrinding to singulation for QFP and FBGA packages.\u003c\/li\u003e\n\u003cli\u003eMaterial characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":47322835910834,"sku":"19108","price":649.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0121\/9441\/4651\/files\/800x800_Shopify_SU_MoorsLaw_Asia_v2_5.png?v=1778780650","url":"https:\/\/store-us.semi.org\/products\/reshaping-moores-law-with-advanced-packaging-8-3-26","provider":"semi.org","version":"1.0","type":"link"}