Historical Book-to-Bill Report (1991-2016) and Billings Report (1991-2025)

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The report provides bookings and billings for North American-based semiconductor equipment manufacturers for the period from 1991 to 2016 and billings data for 1991 - 2025. The data includes front-end (Wafer Processing, Mask/Recticle, Wafer Manufacturing, Fab Facilities) and final manufacturing (Test, Assembly & Packaging).