SEMI103 Hybrid Integration Techniques for Flexible Electronics

TCourse Description 

This course describes techniques practiced at Palo Alto Research Center for fabricating flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits, and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates and also the development of electronics on textiles. 

Course Objectives  

• Describes the techniques and practices at the Palo Alto Research Center (PARC) for fabricating flexible hybrid electronics.
• Explain logic circuits and resistors.
• Explain how to bond integrated circuits.
• Describes how to integrate sensors of different types on flexible substrates without degradation.

Course Duration

60 minutes

Target Audience 

Managers, supervisors, engineers, technicians or any individual working directly with this equipment or product  

Requisite Knowledge 

None