SEMI103 Hybrid Integration Techniques for Flexible Electronics

The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

Specific topics covered in this session include:

• printing interconnects
• printing fine lines, pads and pad pitches with < 100um
• logic circuits and resistors
• bonding integrated circuits
• integrating sensors of different types on flexible substrates without significant performance degradation
• pick and place with micron-level accuracy

Course instruction given by Robert Street, Palo Alto Research Center