Semiconductor Device & Assembly Manufacturing 7/21/26

Semiconductor Device & Assembly Manufacturing  US/EU

Dates & Times

July 21st - July 23rd

8:00 AM– 12:00 PM PST  

Location

Webinar 

Pricing

Early Bird $100

Members:  $799   $699

Non- Members:  $849   $749

The Semiconductor Device and Assembly Manufacturing workshop is a  12-hour webinar that is held for 4 over three days. This three-day workshop provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of fab process steps. Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors.

Day two will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes.

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics. We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all fabrication and assembly process steps and understand how these steps work together to form the completed integrated circuit, as well as future structures. 

By focusing on a Do It Right the First-Time approach to the analysis, participants will learn the appropriate methodology to successfully locate defects, characterize them, and determine the root cause of failure. 

Who Should Attend

• Process Technician

• Material Engineers

• Process Engineers

• Equipment Manufactures

• Technical Marketing Engineers

• Anyone wanting to learn more about semiconductor devices and assembly manufacturing

   

Course Topics

• Silicon wafer manufacturing

• Basic operating principles of transistors and semiconductor devices

• Planar, FinFET, and GAA transistor formation and design differences

• Fab processes needed to form a semiconductor, including the following:

  • Lithography, with a focus on DUV and EUV methods

  • Etching, including wet and plasma processes

  • Deposition, thermal, plasma, electroplating deposition

  • CMP and modern CMP processes

Cancellation and Rescheduling Policies   

·     Registrants may cancel or reschedule a class no less than 30 days before the class start date. 

·       Cancellations received after the stated deadline will not be eligible for a refund.

·       Cancellations will be accepted via email to semiu-support@semi.org

·       All refund requests must be made by the registrant or the credit card holder.

·       Refund requests must include the name of the attendee, the course name, and the date of the session.     

·       Refunds will be credited to the original payment method used for payment.

·       SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class's start date.

·       If SEMI cancels a class, the registrants will be offered a full refund.