Worldwide Assembly & Test Facility Database (IDM + OSAT)
* Price is per User License. Multi-user Discounts may be available. Email firstname.lastname@example.org to inquire.
This database is a comprehensive data file tracking over 475 total back-end facilities of IDMs and outsourced semiconductor assembly and testing manufacturers. This database offers access to and insights into global OSAT facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report also highlights packaging technology offerings by manufacturing location. Details include:
Plant site technology capability: Tape and Reel, Test
Packaging assembly service offered: BGA, specific leadframe type such as QFP, QFN, SO, flip chip bumping, WLP, Modules/SIP, etc.