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This database is a comprehensive data file tracking over 300 back-end facilities that provide outsourced semiconductor assembly and testing manufacturing services. This database offers access to and insights into global OSAT facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report also highlights packaging technology offerings by manufacturing location. Details include:
Plant site technology capability: Tape and Reel, Test
Packaging assembly service offered: BGA, specific leadframe type such as QFP, QFN, SO, flip chip bumping, WLP, Modules/SIP, etc.