Worldwide Assembly & Test Facility Database (IDM + OSAT)

This database is a comprehensive data file that tracks over 670 back-end facilities of IDMs (Integrated Device Manufacturers) and outsourced semiconductor assembly and testing (OSAT) manufacturers globally. This database provides access to and insights into global assembly & test facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report highlights packaging technology offerings by manufacturing location.

The database includes details such as:

• Plant Site technology capability, including Wafer Sort, Final Test, Tape and Reel
• Packaging assembly service offered, such as BGA, Leadframe packages (like QFP, QFN, SO), and Advanced packaging offerings, defined as flip chip bumping and assembly, fan-out and fan-in wafer level packaging (WLP), through silicon via (TSV), 2.5D and 3D capability.
• New in the 2024 edition: Advanced packaging offerings and Automotive certification status.