SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames -

Member Price: $138.00
Non-Member Price: $180.00

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
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Title: SEMI 3D3-1123 - Current




This Guide provides the user with information about containers needed to ship thin wafers that are mounted on dicing tape to tape frames conforming to either SEMI G74 or SEMI G87.


This Guide covers the shipping of 300 mm nominally diameter silicon wafers. The actual diameter of a 300 mm (nominal) silicon wafer may be less than 300 mm due to material removal via edge trim; the diameter of 300 mm silicon wafers fabricated specifically for use as carrier wafers may be greater than 300 mm.
- The maximum diameter of a nominal 300 mm wafer is 301 mm.
- There is not a fixed minimum diameter for nominal 300 mm wafers; edge trim and other processes are not yet standardized; thus, the actual diameter of nominal 300 mm wafers may millimeters smaller.


This Guide may be useful for materials other than silicon, but that is beyond the scope of this Standard.


Referenced SEMI Standards (purchase separately)
SEMI G74 — Specification for Tape Frame for 300 mm Wafers
SEMI G87 — Specification for Plastic Tape Frame for 300 mm Wafer
SEMI G94 — Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
SEMI M31 — Specification for Mechanical Features for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers


Revision History
SEMI 3D3-1123 (technical revision)
SEMI 3D3-0613 (Reapproved 1218)
SEMI 3D3-0613 (first published)

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