SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology -

Abstract

1  Purpose
1.1  The purpose of this Standard is to provide clear and commonly accepted definitions of through glass via (TGV) and to provide a consistent terminology for the understanding and discussion of metrology issues important them.
2  Scope
2.1  This Standard attempts to describe measurands and geometrical features of through and blind vias in glass.
2.2  The focus of this Standard is on geometry-related metrology and measurands important for definition and control of fabrication and inspection operations on structures that include openings for TGV.
2.3  This Standard is intended for through glass vias and blind vias in glass.
2.4  This Standard can be applied to all through and blind vias as they occur in any flat surfaces made of glass, for instance wafers or sheets.
2.5  This Standard adopts and adapts structure and wording from SEMI 3D1, Terminology for Through Silicon Via Metrology.
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Referenced SEMI Standards (purchase separately)
SEMI 3D1 — Terminology for Through Silicon Via Geometrical Metrology
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

Revision History
SEMI 3D11-1214 (Reapproved 1125)
SEMI 3D11-1214 (Reapproved 0420)
SEMI 3D11-1214 (first published)

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