SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology -
Abstract
NOTICE: This Document was reapproved with minor editorial changes.
The purpose of this Document is to provide clear and
commonly accepted definitions of through glass via (TGV) and to provide a
consistent terminology for the understanding and discussion of metrology issues
important them.
Scope
This Document attempts to describe measurands and
geometrical features of through and blind vias in glass.
The focus of this Document is on geometry-related
metrology and measurands important for definition and control of fabrication
and inspection operations on structures that include openings for TGV.
This Document is intended for through glass vias and
blind vias in glass.
This Document can be applied to all through and
blind vias as they occur in any flat surfaces made of glass, for instance
wafers or sheets.
This Document adopts and adapts structure and
wording from SEMI 3D1, Terminology for Through Silicon Via
Metrology.
Referenced SEMI Standards
SEMI 3D1 — Terminology for Through Silicon Via Geometrical Metrology
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