3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Guide is designed to provide definitions for describing a more suitable measurement strategy for low stiffness wafers and geometries.

 

The more suitable measurement process consists of an alternative mounting for wafers with high aspect ratios and the use of high resolution measurements.

 

This Guide also provides a measurement procedure for local bow, which denotes small areas of imperfection of the otherwise flat wafer or substrate.

 

This Guide’s alternative measurement process is suitable for use in materials acceptance and process control, but may also be useful in other applications, such as wafer design and production.


This Guide is intended in general for metrology on low stiffness substrates like wafers or other geometrical shapes such as panels. As low stiffness can occur with any material, this Guide can be applied to all materials that show low stiffness in certain deformation modes.

 

This Guide applies in particular to glass and silicon wafers with a diameter equal to or exceeding 300 mm and their thickness equal to or less than 775 µm ± 20 µm.

 

This Guide also applies to wafers or other geometrical shapes of any material type that show deflections more than 200% of the allowable bow tolerance when tested for bow using the conventional three-point mounting method.

 

Although the accuracy of TTV measurement is not as dependent on deflection as bow and warp are, it makes sense to use the same wafer support configuration when measuring TTV.

 

This Document is a guide for a nondestructive procedure that uses a semicontinuous flat mounting surface and high resolution measurement methods.

 

Referenced SEMI Standards (purchase separately)

SEMI M59 — Terminology for Silicon Technology

SEMI MF534 — Test Method for Bow of Silicon Wafers

SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Slices and Wafers by a Noncontact Scanning Method

SEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning

SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning


Revision History

SEMI 3D12-1020 (technical revision)

SEMI 3D12-0315 (first published)


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