SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the 3DS-IC Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2016. Available at www.semiviews.org and www.semi.org in November 2016.

 

This Specification is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications. Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV).

 

This Specification describes dimensional and thermal characteristics of glass base material for interposers, RF devices, and other similar packaging substrates.

 

This Specification also applies to openings in glass.

 

The glass substrate is in shape of a wafer (round) or a panel (square or rectangular).

 

If present, the openings of the glass substrate may be intended to be further processed with metal fillings.

 

The glass substrate is intended to remain permanently in the package or device.

 

Methods of measurements suitable for determining the characteristics in this Specification are indicated.

 

Referenced SEMI Standards

SEMI 3D7 — Guide for Alignment Mark for 3DS-IC Process
SEMI 3D11 — Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology
SEMI 3D12 — Guide on Measuring Flatness and Shape of Low Stiffness Substrates
SEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers
SEMI G90 — Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
SEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers
SEMI M31 — Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
SEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection
SEMI M40 — Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
SEMI M45 — Specification for 300 mm Wafer Shipping System
SEMI M59 — Terminology for Silicon Technology
SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning
SEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
SEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
SEMI MF1152 — Test Method for Dimensions of Notches on Silicon Wafers
SEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
SEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
SEMI MS1 — Guide to Specifying Wafer-Wafer Bonding Alignment Targets
SEMI T7 — Specification for Back Surface Marking of Double-sided Polished Wafers with a Two-Dimensional Matrix Code Symbol

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