3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology

SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology -

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Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
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Title: SEMI 3D17-1123 - Superseded

Title

Abstract

 

This Specification describes requisite test structures, including design, manufacturing, and certification procedure for a bonded wafer reference sample composed of two wafers.

 

Referenced SEMI Standards (purchase separately)
SEMI 3D13 — Guide for Measuring Voids in Bonded Wafer Stacks
SEMI M20 — Practice for Establishing a Wafer Coordinate System

 

Revision History
SEMI 3D17-1123 (technical revision)
SEMI 3D17-1217 (first published)

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