SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the 3DS-IC Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in December 2017.

 

A bonded wafer reference sample of known void dimensions is needed for metrology system development and calibration. This Specification provides the details that shall be used to create such a bonded wafer reference sample and is based on 300 mm reference samples used in a SEMI round robin study and published as SEMI AUX032-0715, Round Robin Study of Method for Measurement of Voids in Bonded Pairs of Silicon Wafers.

 

This Specification describes requisite test structures, including design, manufacturing, and certification procedure for a bonded wafer reference sample composed of two wafers.

 

Referenced SEMI Standards

SEMI 3D13 — Guide for Measuring Voids in Bonded Wafer Stacks
SEMI M20 — Practice for Establishing a Wafer Coordinate System

Member Price: $113.00
Regular price Non-Member Price: $150.00