3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)

A bonded wafer reference sample of known void dimensions is needed for metrology system development and calibration. This Specification provides the details that shall be used to create such a bonded wafer reference sample and is based on 300 mm reference samples used in a SEMI round robin study and published as SEMI AUX032-0715, Round Robin Study of Method for Measurement of Voids in Bonded Pairs of Silicon Wafers.


This Specification describes requisite test structures, including design, manufacturing, and certification procedure for a bonded wafer reference sample composed of two wafers.


Referenced SEMI Standards

SEMI 3D13 — Guide for Measuring Voids in Bonded Wafer Stacks
SEMI M20 — Practice for Establishing a Wafer Coordinate System

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