SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
Abstract

The purpose of this Document is to establish the standard for the adhesive strength test method of adhesive tray used for thin chip handling and shipping.


This Document covers measuring system (system configuration, die pick up tool).


This Document states test method (die mount layout, measurement environment, peeling speed etc.).


Referenced SEMI Standards

SEMI G97 — Specification for Adhesive Tray Used for Thin Chip Handling

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