3D01900 - SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling
purpose of this Document is to establish the standard for the adhesive strength
test method of adhesive tray used for thin chip handling and shipping.
This Document covers measuring system (system configuration, die pick up tool).
This Document states test method (die mount layout, measurement environment, peeling speed etc.).
Referenced SEMI Standards
SEMI G97 — Specification for Adhesive Tray Used for Thin Chip Handling
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.