3D01900 - SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling

SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling -

Member Price: $144.00
Non-Member Price: $187.00

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI 3D19-0619 (Reapproved 1224) - Current

Revision

Abstract

 

1  Purpose
1.1  The purpose of this Standard is to establish the standard for the adhesive strength test method of adhesive tray used for thin chip handling and shipping.
2  Scope
2.1  This Standard covers measuring system (system configuration, die pick up tool).
2.2  This Standard states test method (die mount layout, measurement environment, peeling speed etc.).

 

Referenced SEMI Standards (purchase separately)
SEMI G97 — Specification for Adhesive Tray Used for Thin Chip Handling

 

Revision History
SEMI 3D19-0619 (Reapproved 1224)
SEMI 3D19-0619 (first published)

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