SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)

Panel Level Packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan-out technology applications.




To permit common processing equipment, standardized panel (largest external) dimensions (whether with or without process carrier) are essential.




To accelerate the adoption of panel level packaging by eliminating the need to customize equipment and processes for a variety of panel sizes.






This Specification focuses on panel (largest external) dimensions (whether with or without process carrier) for use in PLP applications.




The term panel is used to include panel (largest external) dimensions (whether with or without process carrier).




Other optional parameters are included as an Appendix to this Specification.




Referenced SEMI Standards

SEMI G83 — Specification for Bar Code Marking of Product Packages



SEMI M1 — Specification for Polished Single Crystal Silicon Wafers



SEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers




SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol



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