3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications

SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications -

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Non-Member Price: $170.00

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI 3D23-0721 - Current

Revision

Abstract

The purpose of this Specification is to establish basic physical dimensions for the glass carrier intended to be used for panel level package processing.


This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications.<br><br>This Specification describes glass carrier with 510 mm × 515 mm and 600 mm × 600 mm panel sizes as specified by the relevant SEMI 3D20.

 

Referenced SEMI Standards (purchase separately)

SEMI 3D20 — Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications

SEMI D15 — FPD Glass Substrate Waviness Measurement Method

SEMI D24 — Specification for Glass Substrates Used to Manufacture Flat Panel Displays

SEMI G83 — Specification for Bar Code Marking of Product Packages

 

Revision History

SEMI 3D23-0721 (first published)

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