Advanced Packaging Asia 11/03/2025

ADVANCED PACKAGING & MATERIAL CHARACTERIZATION 

Virtual 

November 3rd, 2025

Time 8:30 AM - 5:00 PM GMT +8

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-In, Fan-Out WLP, Embedded packaging technology, System on chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into Advanced Packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical thermal, and thermal reliability performance of the package. 

Course Description

The principles of Microelectronics Packaging range from Electronics, Mechanical, and Materials to Chemical Engineering. Due to this multi-disciplinary nature, many industry professionals don't know what they don't know as they undergo multi-disciplinary training to understand these principles. This course provides the necessary technical knowledge for industry professionals.

Who should attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

• Directors
• Manafers
• Process engineers
• Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

• Understand the principles in the evolution of IC Packaging and how the semiconductor industry has evolved with time.
• Understand the principles of Interconnections ranging from TAB, and wirebond to various Flip chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development.
• Review the interposer of leadframe, ceramic, and flex to BT substrates for Microelectronics packaging.
• Explain the assembly flow and new assembly techniques from backgrinding to singulation
• Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.

Course Topics

• Advanced Packaging and Material Characterization
• Packaging principles and how packaging evolves into heterogeneous packaging.
• Packaging concepts such as Fan-In and Fan-Out WLP, Embedded packaging technology, 3D packaging, TSV.

• Wirebond and Flip-chip interconnect technologies, inclusive of interposer technologies, such as leadframe, ceramic, flex, and substrate.
• Assembly processes from backgrinding to singulation for QFP and FBGA packages.
• Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.

Cancellation and Rescheduling by Registrants

Registrants may cancel or reschedule a class at least 30 days before the class start date.

Cancellations received after the state's deadline will not be eligible for a refund.

Cancellations will be accepted via email to semiu-support@semi.org

The registrant or the credit card holder must make all refund requests.

Refund requests must include the name of the attendee, the Course name, and the date of the session.

Refunds will be credited to the original payment method used for payment. 

SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class's start date.

If SEMI cancels a class, the registrants will be offered a full refund.