Advanced Packaging including Heterogeneous Integration & Chiplets 6/25

Advanced Packaging incl. Heterogeneous Integration & Chiplets 

 Dates & Times 

 June 25, 2026   

 8:00 am-5 pm CT

                                Early Bird Pricing $100 off

                                 Member          $995  $895 

                            Non-Member      $1095 $995

  Location

Aloft Tempe

Meeting Room - Tactic

951 East Playa Del Norte Drive

Tempe, AZ 85281 

480-621-3300

This one-day course addresses IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as is emerging technologies, namely, 3-D and stacked die, and packaging reliability issues. 
 

Learning Objectives: 

• Identify the wide variety of package types and how they align with different application uses.

• Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation.

• Identify the materials and processes used in packaging

• Summarize the current state of the art packages, such as chiplets, heterogeneous packaging 

• Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.

   

Who Should Attend: 

Engineers, technicians, and professionals in the semiconductor industry who need comprehensive training in this specialized area. This course is designed for both newcomers and experienced professionals seeking to enhance their knowledge and skills.

Cancellation and Rescheduling by Registrants

Registrants may cancel or reschedule a class at least 30 days before the class start date. 

Cancellations received after the stated deadline will not be eligible for a refund. 

Cancellations will be accepted via email to semiu-support@semi.org 

The registrant or the credit card holder must make all refund requests. 

Refund requests must include the name of the attendee, the Course Name, and the date of the session. 

Refunds will be credited to the original payment method used for payment. 

SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class's start date. 

If SEMI cancels a class, the registrants will be offered a full refund.