Advanced Packaging & Material Characterization Asia 04/13/2026

Advanced Packaging & Material Characterization for Microelectronics (Asia)

Virtual 

Dates & Times

April 13^th, 2026

8:30 am – 5:00 pm GMT +8

Pricing

Members: $599

Non-Members: $64

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-In, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which is used to enhance the electrical, thermal, and reliability performance of the package. 

The principles of Microelectronics packaging range from electronics, mechanical, and material to chemical engineering. Due to this multi-disciplinary nature, many industry professionals don’t know what they don’t know as they undergo multi-disciplinary training to understand these principles. This course provides the necessary technical knowledge for industry professionals. 

Who Should Attend 

• Directors
• Managers
• Process Engineers
• R&D Engineers
• Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

• Understand the principles in the evolution of IC packaging and how the semiconductor industry has evolved over time.
• Understand the principles of Interconnections, ranging from TAB, and wire bond to various Flip Chip bonding, such as thermocompression bonding with NCP< C4, ACT for manufacturing and R&D development.
• Review the interposer of leadframe, ceramic, and flex to BT substrates for microelectronics packaging. Explain the assembly flow and new assembly techniques from back grinding to singulation.
• Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.

Cancellation and Rescheduling Policy

Registrants may cancel or reschedule a class no less than 30 days before the class start date.

Cancellations received after the stated deadline will not be eligible for a refund.

Cancellation will be accepted via email to semiu-support@semi.org

All refund requests must be made by the registrant or the credit card holder.

Refunds will be credited to the original payment method used for payment.

SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class’s start date.

If SEMI cancels a class, the registrants will be offered a full refund.