Advanced Semiconductor Packaging Course Manual

Description: This manual covers advanced semiconductor packaging concepts, including chiplets, wafer-level packaging (WLP), 3D Stacking, and flip chip technologies.    

Target Audience: Anyone seeking a better understanding of the assembly and packaging of semiconductor devices, especially using advanced technologies.

Note: This manual is only available for purchase at SEMI Shows, like SEMICON West, ASMC, and SEMIExpo. Not available for online purchase.