Arizona and Texas Chapter's Virtual Fall Forum 2025

Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way

As the semiconductor industry pushes the boundaries of performance, efficiency, and miniaturization, advanced packaging has emerged as a critical enabler of next-generation microelectronics. This virtual forum brings together leading voices from across the ecosystem to explore how backend manufacturing is driving innovation and collaboration in advanced packaging technologies.

Topics to be discussed:
-The evolving role of backend manufacturing in enabling heterogeneous integration and chiplet architectures
-Key challenges and opportunities in scaling advanced packaging solutions
-Collaborative models for building a robust ecosystem—from academia to industry
-Workforce development and infrastructure needs to support future growth
-Insights into government and industry initiatives shaping the future of microelectronics manufacturing

Whether you're a technologist, strategist, or policymaker, this forum offers a unique opportunity to gain actionable insights into the future of semiconductor packaging and the collaborative efforts driving it forward.

CANCELLATION POLICY:
This is an online recorded event; therefore, you will receive the content recording following the event.  We are not processing refunds or cancellations.

EVENT CONTACT:
Michelle Fabiano
Email:  MFabiano@semi.org 
Mobile:  +1.310.930.7669