C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing
The purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap for the development of new semiconductor technologies. Reference to this Guide can be used in the corresponding CoA from a CMP supplier to its customers.
This Document provides guidance on how CMP PSD should be reported on a CoA.
The Related Information section provides extensive background information on several topics:
· What a full CoA for CMP slurries should contain (not just PSD).
· The fundamentals for measuring any PSD with specific references to what should be reported for CMP slurries.
· CMP sample preparation.
· Details for four CMP PSD measurement techniques together with the advantages and disadvantages of each technique.
Referenced SEMI Standards
SEMI C96 — Test Method for Determining Density of Chemical Mechanical Polish (CMP) Slurries
SEMI F63 — Guide for Ultrapure Water used in Semiconductor Processing
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