SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing

Volume(s): Process Chemicals
Language: English
Type: Single Standards Download (.pdf)
Abstract

The purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap for the development of new semiconductor technologies. Reference to this Guide can be used in the corresponding CoA from a CMP supplier to its customers.


This Document provides guidance on how CMP PSD should be reported on a CoA.

 

The Related Information section provides extensive background information on several topics:

·      What a full CoA for CMP slurries should contain (not just PSD).

·      The fundamentals for measuring any PSD with specific references to what should be reported for CMP slurries.

·      CMP sample preparation.

·      Details for four CMP PSD measurement techniques together with the advantages and disadvantages of each technique.

 

Referenced SEMI Standards

SEMI C96 Test Method for Determining Density of Chemical Mechanical Polish (CMP) Slurries

SEMI F63 — Guide for Ultrapure Water used in Semiconductor Processing

 

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