SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Polish (CMP) Slurries and Related Chemicals
This Document provides a standardized test method for measuring and reporting the conductivity of slurries and post-chemical mechanical polish (CMP) chemicals. The test method will define the number of significant digits to which conductivity will be reported, given the limitations of current metrology and methodology capabilities, and define a standardized temperature for the measurement. This Document will also supply a method of calibrating conductivity probes and temperature analytics relative to standards.
This Document applies to slurries and post-CMP application chemicals determined by the manufacturer and/or integrated device manufacturer (IDM) to be relevant as a measure of material quality.
This Document describes the conditions and procedures for measuring the conductivity of single or multi-component slurries and post-CMP chemicals with offline (benchtop) metrology instrumentation.
This Document provides a common basis for communication between slurry manufacturers and users.
Referenced SEMI Standards
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