SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing
This Document will provide a guide for the measurements of and reporting of more accurate parameters of hardness of chemical mechanical planarization (CMP) pads, than current industry standards.
This Document will provide a guide for the measurement of and reporting of effect of the temperature on the pad hardness.
Reference to this Guide can be used in the corresponding certificate of acceptance (CoA) from a CMP supplier to its customers.
Reference to this Guide can be used for generating roadmaps for the development of new semiconductor technologies.
This Document provides guidance on how hardness of CMP pads should be reported, for example, on a CoA.
Related Information 1 provides extensive background information on the following topics:
Details of the test conditions to be reported on, for example, CoA for measurement of the hardness of CMP pads.
The fundamentals for measuring pad hardness using more accurate metrologies, than the current industry process of record (POR) shore hardness (SH), or compressibility.
The fundamentals and justification for measurements and reporting on, for example, CoA hardness at different ambient temperatures.
List of deformation modes appropriate for the pads of different range of hardness and manufacturing styles.
Referenced SEMI Standards (purchase separately)
SEMI C100-1120 (first published)
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