SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing -
This Guide provides directions for measurements and reporting the parameters of chemical mechanical planarization (CMP) pad windows.
This Guide provides directions for reporting metrology tools used to measure parameters of the CMP pad windows.
This Guide provides the list of the parameters for CMP pad windows required to measure and report on quality documents.
Reference to this Guide can be used in the quality documents (i.e., in the technical data package or corresponding certificate of acceptance [CoA]) from a pad supplier to an original device manufacturer (ODM)/integrated device manufacturer (IDM) customer.
Reference to this Guide can be used for generating roadmaps for the development of new semiconductor technologies and materials.
This Guide provides guidance on how and what parameters of CMP pad windows should be reported on quality documents (e.g., CoA), including:
Reporting individual wavelengths and wavelength bands for measuring windows transmission.
Transmission degradation should include reporting the number and intensity of the laser beam exposures.
Referenced SEMI Standards (purchase separately)
SEMI C104-0622 (first published)
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