Chiplet and Heterogenous Integration US

Chiplet & Heterogenous Integration for

Microelectronics Packaging

Dates & Times

Jan 22nd & Jan 23rd

2:00 PM - 6:00 PM PST 

Location

Webinar 

Pricing

Members: $599

Non-Members: $649

This workshop reviews the need for the packaging solutions to meet the demand for digitalization through the artificial intelligence and the internet-of-things from urbanization, and sustainability to industry. The course provides an overview of the fabrication process of IC carriers of leadframe, ceramics, substrate, and flex and how they have to evolve to meet the heterogeneous integration. With these foundations, various stacking and integration technologies through wirebonding, flip chip and 3D interconnect from interconnect to system level will be shared. Packaging innovation of TSV,  fan-in, fan-out wafer level packaging, and its challenges will also be shared for chiplet and heterogeneous integration. It ends off by sharing the embedded technologies and embedded multi-die interconnect bridge for chiplet and heterogeneous integration. 

The course looks into the R&D development as well as the dynamic changes of heterogeneous integration technologies in the Semiconductor packaging arena. This workshop curates the technology development to date and provides the necessary information for professionals in the manufacturing and R&D environment to perform their tasks. 

Learning Objectives:

• Understand why chiplet and heterogeneous integration for advanced packaging. 
• Review of IC carriers.
• Summarize 3D and TSV for chiplet and heterogeneous integration. 
• Explain fan-in and fan-out wafer-level packaging for chiplet and heterogeneous integration.
• Describe chiplet, embedded, and embedded multi-die interconnect beam for chiplet and glass substrate for heterogenous integration. 

Who should Attend:

This course is suitable for manufacturing and R&D know-how in IC packaging professionals, including but not limited to: Directors, Managers, Process Engineers, R&D Engineers, and Sales and Applications engineers who supply packaging materials and tools. 

Cancellation and Rescheduling Policies   

·     Registrants may cancel or reschedule a class no less than 30 days before the class start date. 

·       Cancellations received after the stated deadline will not be eligible for a refund.

·       Cancellations will be accepted via email to semiu-support@semi.org

· The registrant or the credit card holder must make all refund requests.

·       Refund requests must include the attendee's name, Course Name, and session date.     

·       Refunds will be credited to the original payment method used for payment.

·       SEMI reserves the right to cancel any course due to low enrollment or other circumstances which would make the event unavailable 7 business days before the class's start date.

·       If SEMI cancels a class, the registrants will be offered a full refund.