SEMI E1 - Specification for Open Plastic and Metal Wafer Carriers

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 11, 2016. Available at www.semiviews.org and www.semi.org in August 2016; originally published in 1979; previously published November 2010.

 

This Specification provides the dimensional requirements for plastic and metal wafer carriers used for the processing and handling of 3 in., 100 mm, 125 mm and 150 mm diameter wafers. It also includes some related information on, but not a specification for, 200 mm diameter wafer carriers.

 

This Specification has two classifications: General Usage and Auto Transport Usage.

General Usage is a basic guideline that covers 3 in., 100 mm, 125 mm, and 150 mm wafer sizes.

Auto Transport Usage is intended to meet the in-use requirements for the interface of wafer carriers with automated wafer processing equipment. Auto Transport Usage covers the 125 mm wafer size.

There is some related information (of historical interest, but not part of the requirements) on the 200 mm wafer size.

 

To meet these specifications, carriers must be manufactured within the dimensional limits and be dimensionally stable within the specification when used in accordance with manufacturers’ recommendations.

 

Referenced SEMI Standards

None.

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