SEMI E6 - Guide for Semiconductor Equipment Installation Documentation -

Abstract

Within the semiconductor industry, the diversity and complexity of equipment creates difficult challenges for facilities design and equipment installation. This Guide should benefit equipment suppliers and semiconductor manufacturers by communicating, in a standardized way, the information necessary to prepare the facility and to efficiently install semiconductor equipment.

This Standard applies to the facilities interface of all semiconductor production equipment and supplier-provided support equipment.

 

The recommended equipment installation documentation should cover all installation requirements from receiving until hookup is complete.

 

The series of data sheets included should address all site facilities necessary to support semiconductor equipment processing.

 

The data sheets provide a consistent format for both the equipment supplier and equipment purchaser to use in compiling and interpreting equipment installation data.

 

Referenced SEMI Standards (purchase separately)

SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)

SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface

SEMI E70 — Guide for Tool Accommodation Process

SEMI E72 — Specification and Guide for 300 mm Equipment Footprint, Height, and Weight

SEMI E73 — Specification for Vacuum Pump Interfaces – Dry Pumps

SEMI E74 — Specification for Vacuum Pump Interfaces – Turbomolecular Pumps

SEMI E76 — Guide for 300 mm Process Equipment Points of Connection to Facility Services

SEMI E106 — Provisional Overview Guide to SEMI Standards for Physical Interfaces and Carriers for 300 mm Wafers

 

Revision History

SEMI E6-0914 (technical revision)

SEMI E6-0303 (complete rewrite)

SEMI E6-1296 (technical revision)

SEMI E6-96 (technical revision)

SEMI E6-92 (technical revision)

SEMI E6-85 (technical revision)

SEMI E6-84 (technical revision)

SEMI E6-82 (first published)

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