SEMI E6 - Guide for Semiconductor Equipment Installation Documentation

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Gases Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 12, 2014. Available at and in September 2014; originally published in 1982; previously published March 2003.


Within the semiconductor industry, the diversity and complexity of equipment creates difficult challenges for facilities design and equipment installation. This Guide should benefit equipment suppliers and semiconductor manufacturers by communicating, in a standardized way, the information necessary to prepare the facility and to efficiently install semiconductor equipment.


This Standard applies to the facilities interface of all semiconductor production equipment and supplier-provided support equipment.


The recommended equipment installation documentation should cover all installation requirements from receiving until hookup is complete.


The series of data sheets included should address all site facilities necessary to support semiconductor equipment processing.


The data sheets provide a consistent format for both the equipment supplier and equipment purchaser to use in compiling and interpreting equipment installation data.


Referenced SEMI Standards

SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
SEMI E70 — Guide for Tool Accommodation Process
SEMI E72 — Specification and Guide for 300 mm Equipment Footprint, Height, and Weight
SEMI E73 — Specification for Vacuum Pump Interfaces – Dry Pumps
SEMI E74 — Specification for Vacuum Pump Interfaces – Turbomolecular Pumps
SEMI E76 — Guide for 300 mm Process Equipment Points of Connection to Facility Services
SEMI E106 — Provisional Overview Guide to SEMI Standards for Physical Interfaces and Carriers for 300 mm Wafers

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