SEMI E21 - Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2015. Available at and in October 2015; originally published in 1991; previously published March 2009.


The purpose of this Specification is to simplify cluster tool implementation in the fab. Equipment suppliers are required to provide modules that can be connected into any cluster tool using the specifications contained herein.


Process and cassette modules accept wafers at locations that may vary substantially from one module to another. This places a burden on the capabilities of transport modules to move wafers to and from various modules in a cluster tool. This Specification defines wafer transport planes within cassette and process modules. This obviates the wafer transport problem to a large extent, but does not unduly restrict module content.


This Specification defines the interface plane between modules in a cluster tool. It provides the mechanical specifications at the interface that allow modules from different suppliers to be connected together; no requirements are imposed on the module content.


This Specification is limited to wafers which are 200 mm (~8 in.) in diameter or smaller and to the interface between cluster tool modules, with the following exception. The transport module operates across the interface plane; thus, a definition of the wafer transport plane within cassette and process modules is required.


Subordinate Document:

SEMI E21.1-1015 — Specification for Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport


Referenced SEMI Standards


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