SEMI E22 - Specification for Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume -

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Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI E22-1015 - Inactive

Revision

Abstract


NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

The purpose of this Specification is to provide sufficient detail to allow the transport module end effector to move wafers to and from process and cassette modules in a cluster tool without mechanical interference.


This Specification describes the volume within any process or cassette module which shall be accessible to the transport module end effector in a cluster tool. The standard is limited to modules which accommodate wafer sizes from 100 mm up to and including 200 mm in diameter.


Subordinate Standards (included)

SEMI E22.1-1015 — Specification for Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume

 

Referenced SEMI Standards (purchase separately)

SEMI E1 — Specification for 3 inch, 100 mm, 125 mm, and 150 mm Plastic and Metal Wafer Carriers

SEMI E21 — Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport

 

Revision History

SEMI E22-1015 (technical revision)

SEMI E22-0697 (Reapproved 0309)

SEMI E22-0697 (Reapproved 1102)

SEMI E22-0697 (technical revision)

SEMI E22-91 (first published)

 

SEMI E22.1-1015 (technical revision)

SEMI E22.1-0309 (technical revision)

SEMI E22.1-1296 (Reapproved 1102)

SEMI E22.1-1296 (technical revision)

SEMI E22.1-92 (first published)

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