SEMI E22 - Specification for Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume
This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2015. Available at www.semiviews.org and www.semi.org in October 2015; originally published in 1991; previously published March 2009.
The purpose of this Specification is to provide sufficient detail to allow the transport module end effector to move wafers to and from process and cassette modules in a cluster tool without mechanical interference.
This Specification describes the volume within any process or cassette module which shall be accessible to the transport module end effector in a cluster tool. The standard is limited to modules which accommodate wafer sizes from 100 mm up to and including 200 mm in diameter.
SEMI E22.1-1015 - Specification for Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume
Referenced SEMI Standards
SEMI E1 — Specification for 3 inch, 100 mm, 125 mm, and 150 mm Plastic and Metal Wafer Carriers
SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E21 — Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport