SEMI E51 - Guide for Typical Facilities Services and Termination Matrix
This guide was technically approved by the global Facilities Committee and is the direct responsibility of the North American Facilities Committee. Current edition approved by the North American Regional Standards Committee on December 15, 1999. Initially available at www.semi.org January 2000; to be published February 2000. Originally published in 1995; previously published February 1998.
The objectives of this guide are to ensure a timely and cost-effective tool installation with minimum impact on the existing customer facilities, systems, and services and to insure that the quality of facilities supplied (e.g., water, gases, chemicals, electricity) is not compromised once internal to the tool. This guide provides the equipment supplier with an understanding of the facilities available at the point of connection (POC) at the "typical" customer site. If these typical facility services are considered by tool manufacturers during their tool design, additional cost and lead times associated with customizing each tool installation can be minimized resulting in reduced costs to build and install semiconductor equipment.
Referenced SEMI Standards
SEMI E6 — Facilities Interface Specifications Guideline and Format
SEMI E7 — Specification for Electrical Interfaces for the U.S. Only
SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E33 — Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility
SEMI E49 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
SEMI F47 — Specification for Semiconductor Processing Equipment Voltage Sag Immunity