SEMI E51 - Guide for Typical Facilities Services and Termination Matrix -

Member Price: $144.00
Non-Member Price: $187.00

Volume(s): Equipment Automation Hardware / Facilities
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI E51-0200 - Current

Revision

Abstract

 

1  Purpose
1.1  The objectives of this Guide are to ensure a timely and cost-effective tool installation with minimum impact on the existing customer facilities, systems, and services, and to insure that the quality of facilities supplied (e.g., water, gases, chemicals, electricity) is not compromised once internal to the tool.
1.2  This Guide provides the equipment supplier with an understanding of the facilities available at the point of connection (POC) at the ‘typical’ customer site. If these typical facility services are considered by tool manufacturers during their tool design, additional cost and lead times associated with customizing each tool installation can be minimized resulting in reduced costs to build and install semiconductor equipment.
2  Scope
2.1  This Guide does not include site-specific conditions. The Typical Facilities Services and Termination Matrix Example—United States (refer to Table 1) identifies utilities, performance, and connections at typical semiconductor facilities. When site specifications differ, the user should create a Site-Specific Facilities Services and Termination Matrix (refer to Table 2) that is submitted with the request for a quote. Each tool should be supplied in a ‘facility ready’ state. This Guide represents the range of conditions in which equipment should be capable of operating.

 

Referenced SEMI Standards (purchase separately)
SEMI E6 — Facilities Interface Specifications Guideline and Format
SEMI E7 — Specification for Electrical Interfaces for the U.S. Only
SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E33 — Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility
SEMI E49 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
SEMI F47 — Specification for Semiconductor Processing Equipment Voltage Sag Immunity

 

Revision History
SEMI E51-0200 (technical revision)
SEMI E51-0298 (technical revision)
SEMI E51-95 (first published)

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