SEMI E70 - Guide for Tool Accommodation Process
This Standard was technically approved by the Facilities Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 22, 2013. Available at www.semiviews.org and www.semi.org in December 2013; originally published June 1998; previously published November 2003.
This Document will provide an overview of the various elements of Tool Accommodation, a methodology by which semiconductor processing equipment is installed in a cost-effective and timely manner. This addition to the SEMI Tool Accommodation Standards set describes the process by which the referenced SEMI Documents can be effectively used to achieve tool installation cost and schedule goals.
This overview Document will provide process development, facilities, manufacturing, and sales engineers (as well as purchasing agents and managers) with a basic understanding of the various elements in a Tool Accommodation methodology. This process emphasizes quality, completeness, timeliness, and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities. By describing a generic process flow, this document identifies a road map for using published standards that comprehend all the procedures involved in tool accommodation from procurement through acceptance. As a common ground for communication and comparison, terms and definitions are also included.
Referenced SEMI Standards
SEMI E6 — Guide for Semiconductor Equipment Installation Documentation
SEMI E10 Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM)
SEMI E45 — Test Method for the Determination of Inorganic Contamination frok Minienvironments Using Vapor Phase Decomposition-Total Reflection X-Ray Spectroscopy (VPD-TXRF), VPD-Atomic Absorption Spectroscopy (VPD-AAS), or VPD/Inductively Coupled Plasma- Mass Spectrometry (VPD/ICP-MS)
SEMI E49 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
SEMI E49.1 — Guide for Tool Final Assembly, Packaging and Delivery
SEMI E49.2 — Guide for High Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment
SEMI E49.3 — Guide for Ultrahigh Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment
SEMI E49.4 — Guide for High Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment
SEMI E49.5 — Guide for Ultrahigh Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment
SEMI E49.6 — Guide for Subsystem Assembly and Testing Procedures - Stainless Steel Systems
SEMI E49.7 — Purity Guide for the Design and Manufacture of Ultrapure Water and Liquid Chemical Systems in Semiconductor Process Equipment
SEMI E49.8 — Guide for High Purity and Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment
SEMI E51 — Guide for Typical Facilities Services and Termination Matrix
SEMI S4 — Safety Guideline for the Segregation/Seperation of Gas Cylinders Contained in Cabinets