SEMI E70 - Guide for Tool Accommodation Process -

Abstract

This Guide provides an overview of the various elements of Tool Accommodation, a methodology by which semiconductor processing equipment is installed in a cost-effective and timely manner. This addition to the SEMI Tool Accommodation Standards set describes the process by which the referenced SEMI Standards can be effectively used to achieve tool installation cost and schedule goals.

This overview Guide provides process development, facilities, manufacturing, and sales engineers (as well as purchasing agents and managers) with a basic understanding of the various elements in a Tool Accommodation methodology. This process emphasizes quality, completeness, timeliness, and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities. By describing a generic process flow, this document identifies a road map for using published standards that comprehend all the procedures involved in tool accommodation from procurement through acceptance. As a common ground for communication and comparison, terms and definitions are also included.

 

Referenced SEMI Standards (purchase separately)

SEMI E6 — Guide for Semiconductor Equipment Installation Documentation

SEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization

SEMI E45 — Test Method for the Determination of Inorganic Contamination from Minienvironments Using Vapor Phase Decomposition-Total Reflection X-Ray Spectroscopy (VPD-TXRF), VPD-Atomic Absorption Spectroscopy (VPD-AAS), or VPD/Inductively Coupled Plasma-Mass Spectrometry (VPD/ICP-MS

SEMI E49 — Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies

SEMI E49.2 — Guide for the Qualification of Polymer Assemblies Used in Ultrapure Water and Liquid Chemical Systems in Semiconductor Process Equipment

SEMI E49.4 — Guide for Ultrahigh Purity Solvent Distribution Systems with Metallic Fluid Paths in Semiconductor Manufacturing Equipment

SEMI E49.5 — Guide for the Design of Ultrahigh Purity Solvent Distribution Systems with Non-Metallic Fluid Paths in Semiconductor Manufacturing Equipment

SEMI E49.6 — Guide for Subsystem Assembly and Testing Procedures - Stainless Steel Systems

SEMI E49.7 — Guide for the Design and Manufacture of Polymer Assemblies Used for Liquid Chemical Systems in Semiconductor Equipment

SEMI E49.8 — Guide for High Purity and Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E51 — Guide for Typical Facilities Services and Termination Matrix

SEMI E137 — Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment

SEMI S4 — Safety Guideline for the Segregation/Separation of Gas Cylinders Contained in Cabinets

 

Revision History

SEMI E70-1213 (Reapproved 1021)

SEMI E70-1213 (technical revision)

SEMI E70-1103 (technical revision)

SEMI E70-0698 (technical revision)

SEMI E70-0298 (first published)

Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.