SEMI E72 - Specification and Guide for Equipment Footprint, Height, and Weight
This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2016. Available at www.semiviews.org and www.semi.org in October 2016; originally published in 1998; previously published March 2005.
NOTICE: This Document was completely rewritten in 2016
To help semiconductor device manufacturers plan or retrofit their fabs, this Standard provides equipment suppliers with definitions and limitations on the footprint occupied by production equipment during operation, height, weight, and the areas needed for maintenance and service.
Equipment suppliers need to know what limitations there are for equipment configurations and for moving equipment into facilities in order to design their products.
This Standard specifies limits on the footprint, height, and weight of production equipment for wafers of 300 mm or greater diameter. Separate limits are given for the parts of the equipment in the main fab and in the subfab. Separate limits are given also for the equipment after it is installed and for the components of the equipment as it is moved into the fab. The actual footprint may vary by equipment type.
This Standard limits the kinds of activities that may occur near the load face plane of the equipment.
This Standard is intended to set an appropriate level of specification that places minimal limits on supplier innovation while ensuring opportunities for users to be globally (though possibly not locally) efficient with equipment volumes.
Referenced SEMI Standards
SEMI E15.1 — Specification for 300 mm Tool Load Port
SEMI E35 — Guide to Calculate Cost of Ownership Metrics for Semiconductor Manufacturing Equipment
SEMI E140 — Guide to Calculate Cost of Ownership Metrics for Gas Delivery Systems
SEMI E154 — Mechanical Interface Specification for 450 mm Load Port