SEMI E74 - Specification for Vacuum Pump Interfaces - Turbomolecular Pumps

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 20, 2012. Available at and in April 2013; originally published June 1998; previously published March 2007.


NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.


This Standard specifies the physical and electrical interfaces for turbomolecular pump (TMP) type vacuum pumps. Standardization of pump interfaces will allow for interchangeability of pumps. Device manufacturers use this standard when procuring processing equipment to specify to the equipment supplier the interface required for interchangeability of pumps. This Document is also used by semiconductor processing equipment suppliers to specify standardized interfaces to pump suppliers.


This Standard applies to vacuum pumps supplied with 300 mm semiconductor processing equipment.


The Standard specifies the mechanical and electrical interfaces for turbomolecular pumps, including the following:

• Mechanical connectors and locations

• Control signals and connector

• Power supply and connector


Referenced SEMI Standards

SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment

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