E08400 - SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
Abstract

Due to the migration to large wafer sizes, future semiconductor factories will use extensive automated material handling systems (AMHS) to transfer wafer carriers, including FOUPs and open cassettes, of increasing weight. The parallel input/output (PI/O) control signals between the production equipment and the AMHS must be better defined for more reliable and efficient carrier handoffs (load/unload) at production equipment load ports.

 

The purpose of this Specification is to enhance the capabilities of the parallel I/O interface defined in SEMI E23 in order to support improvements in the reliability and efficiency of carrier transfer. The enhanced capabilities include continuous handoff, simultaneous handoff, and the capabilities of error detection on the interface.

 

The scope of this Specification is limited to communications associated with the material handoff operations between the active equipment (e.g., AMHS equipment including AGV, RGV and OHT) and the passive equipment (e.g., production equipment including process and metrology equipment; stockers, etc.). This scope also extends to interbay AMHS active equipment (i.e., OHS and stockers equipped with transfer devices) and passive equipment (i.e., OHS and stockers not equipped with transfer devices). This Specification defines the enhanced parallel I/O interface signals used to handoff carriers between the production equipment and the AMHS. Figures 1 and 2 show examples of types of AMHS equipment.

 

This enhanced carrier handoff parallel I/O interface specification includes:

• Signal definition including load port assignment signals (¶ 6.1),

• Carrier handoff sequence definitions and time diagrams (¶ 6.2),

• Error indication, detection, and recovery (¶ 6.3 and ¶ 6.4),

• Connector type, signal, and pin assignment (¶ 6.4), and

• Interface sensor unit size to be located at load port defined by SEMI E15.1 (applicable for systems designed to handle 300 mm wafer carriers).

 

The enhanced carrier handoff parallel I/O interface controls the handoff of a carrier to and from the passive equipment by the active equipment. This parallel I/O interface only controls the automated handoff operation of the carrier. The handoff is the operation in which a carrier is transferred from one piece of equipment to another. Both the active and passive equipment manage this operation. The factory level controller (i.e., host) does not manage the handoff operation. Figure 3 shows applications for the parallel I/O interface specified in this Document.

 

Referenced SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15.1 — Specification for 300 mm Tool Load Port
SEMI E23 — Specification for Cassette Transfer Parallel I/O Interface
SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers
SEMI E87 — Specification for Carrier Management (CMS)

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