SEMI E100 - 6インチまたは230 mmのレチクルの搬送および保管に用いられるレチクルSMIFポッド(RSP)の仕様 -

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Non-Member Price: $203.00

Volume(s): Equipment Automation Hardware / Microlithography
Language: Japanese
Type: Single Standards Download (.pdf)
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Revision: SEMI E100-1104 (Reapproved 0710) - Inactive



本スタンダードは,Global Physical Interfaces and Carriers Committee技術的に承認されている。現版は2010430日,Global Audits and Reviews Subcommitteeにて発行が承認された。20106月にwww.semi.orgで入手可能となる。初版は20002発行,前版は200411月発行。


本スタンダードは,レチクル(フォトマスク)あるいは集積回路(IC)製造施設において,6インチまたは230 mmのレチクルを搬送および保管するために用いられるレチクルSMIF PODRSP)について規定する。


Referenced SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E19.4 — 200 mm Standard Mechanical Interface (SMIF)
SEMI E30.1 — Inspection and Review Specific Equipment Model (ISEM)
SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers
SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers
SEMI P5 — Specification for Pellicles

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