SEMI E106 - Overview Guide to SEMI Standards for Physical Interfaces and Carriers for 300 mm Wafers -

Abstract

This standard was technically approved by the global Physical Interfaces & Carriers Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on April 30, 2010. Initially available at www.semi.org in June 2010. Originally published October 2000; previously published November 2004. This document replaces SEMI PR6-0200 in its entirety.

 

NOTICE: This document was balloted and approved for withdrawal in 2010.

 

This document is intended to help users and suppliers of 300 mm carriers and production equipment to understand the complex interdependencies among the SEMI Standards for 300 mm physical interfaces and carriers and to determine which standards apply to which products.

　

Referenced SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM)
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load Port
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E19.4 — 200 mm Standard Mechanical Interface (SMIF)
SEMI E21.1 — Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard
SEMI E22.1 — Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard
SEMI E23 — Specification for Cassette Transfer Parallel I/O Interface
SEMI E25 — Cluster Tool Module Interface: Module Access Guideline
SEMI E26.1 — Radial Cluster Tool Footprint 300 mm Standard
SEMI E45 — Test Method for the Determination of Inorganic Contamination from Minienvironments Using Vapor Phase Decomposition-Total Reflection X-Ray Spectroscopy (VPD-TXRF), VPD-Atomic Absorption Spectroscopy (VPD-AAS), or VPD/Inductively Coupled Plasma-Mass Spectrometry (VPD/ICP-MS)
SEMI E46 — Test Method for the Determination of Organic Contamination from Minienvironments Using Ion Mobility Spectrometry (IMS)
SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers
SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers
SEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
SEMI E64 — Specification for 300 mm Cart to SEMI E15.1 Docking Interface Port
SEMI E70 — Guide for Tool Accommodation Process
SEMI E72 — Specification and Guide for 300 mm Equipment Footprint, Height, and Weight
SEMI E82 — Specification for Interbay/Intrabay AMHS SEM (IBSEM)
SEMI E83 — Specification for 300 mm PGV Mechanical Docking Flange
SEMI E84 — Specification for Enhanced Carrier Handoff Parallel I/O Interface
SEMI E85 — Specification for Physical AMHS Stocker to Interbay Transport System Interoperability
SEMI E92 — Specification for 300 mm Light Weight and Compact Box Opener/Loader to Tool-Interoperability Standard (BOLTS/Light))
SEMI E99 — The Carrier ID Reader/Writer Functional Standard: Specification of Concepts, Behavior, and Services
SEMI E99.1 — Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer Functional Standard
SEMI E100 — Specification for a Reticle SMIF Pod (RSP) Used to Transport and Store 6 Inch or 230 mm Reticles
SEMI E101 — Guide for EFEM Functional Structure Model
SEMI E103 — Provisional Mechanical Specification for a 300 mm Single-Wafer Box System that Emulates a FOUP
SEMI G74 — Specification for Tape Frame for 300 mm Wafers
SEMI G77 — Specification for Frame Cassette for 300 mm Wafers
SEMI M1.15 — Standard for 300 mm Polished Monocrystalline Silicon Wafers (Notched)
SEMI M8 — Specification for Polished Monocrystalline Silicon Test Wafers
SEMI M28 — Specifications for Developmental 300 mm Diameter Polished Single Crystal Silicon Wafers
SEMI M29 — Specification for 300 mm Shipping Box
SEMI M31 — Provisional Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment
SEMI S11 — Environmental, Safety, and Health Guidelines for Semiconductor Manufacturing Equipment Minienvironments

Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.