SEMI E113 - Specification for Semiconductor Processing Equipment RF Power Delivery Systems -

Abstract

NOTICE: This Standard was completely rewritten in 2024.

1  Purpose
1.1  It is the intent of this Standard to provide radio frequency (RF) power-delivery system specifications for semiconductor processing equipment that leads to improved system and subsystem performance. It outlines performance criteria as well as required documentation to be supplied with the RF power-delivery systems or subsystem components. The goal of the Standard is to provide the specifications needed to produce a well-characterized RF power-delivery system, where stability, repeatability, and important electrical parameters such as delivered power, current/voltage, and the impedance of the system can be determined within the operating space.
2  Scope
2.1  This Standard specifies the minimum performance criteria for RF power-delivery systems used in the semiconductor industry. It does not address specific test methods or procedures for performance verification.
2.2  The primary focus for this Standard is an RF power-delivery system that is incorporated into semiconductor processing equipment including, but not limited to, the following equipment types:
• Dry etch equipment, and
• Film deposition equipment (chemical vapor deposition [CVD] and physical vapor deposition [PVD]).
2.3  This Standard applies to semiconductor processing equipment RF power-delivery systems whose power is directly used to produce and sustain the plasma or is electrically connected to the plasma (i.e., bias power).
2.4  Although the primary focus of this Standard is RF power-delivery systems used in the semiconductor processing equipment, this Standard can be applied to RF power deliver systems used in similar processing equipment for other high-tech industries (e.g., flat panel display [FPD], high-brightness light emitting diode [HB-LED], microelectromechanical systems/nanoelectromechanical systems [MEMS/NEMS]).

Referenced SEMI Standards (purchase separately)
SEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
SEMI E33 — Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC)
SEMI E89 — Guide for Measurement System Analysis (MSA)
SEMI E114 — Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems
SEMI E115 — Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems
SEMI E135 — Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems used in Semiconductor Processing Equipment
SEMI E136 — Test Method for Determining the Output Power of RF Generators Used in Semiconductor Processing Equipment RF Power Delivery Systems
SEMI E143 — Test Method for Measuring Power Variation into a 50 Ω Load and Power Variation and Spectrum into a Load with a VSWR of 2.0 at Any Phase Angle

Revision History
SEMI E113-0724 (complete rewrite)
SEMI E113-0306 (Reapproved 0518)
SEMI E113-0306 (Reapproved 0512)
SEMI E113-0306 (technical revision)
SEMI E113-1104 (technical revision)
SEMI E113-1103 (technical revision)
SEMI E113-1102 (technical revision)
SEMI E113-1101 (first published)

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