SEMI E113 - Specification for Semiconductor Processing Equipment RF Power Delivery Systems -

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Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI E113-0306 (Reapproved 0518) - Current



This Standard was technically approved by the global Metrics Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 13, 2017. Available at and in May 2018; originally published November 2001; previously published May 2012.


Process plasmas are used throughout the semiconductor industry for the etching and deposition of thin films. The majority of the process chambers use radio frequency (RF) power to produce and sustain the plasmas. Because the reliability and repeatability of the plasma directly impacts wafer-processing results, RF power delivery systems are a key element of semiconductor manufacturing technology. The accurate and reproducible performance of the entire RF power generation system, including the RF-influenced parameters of the plasma, must be within commonly accepted tolerances.


Design criteria for RF reliability and repeatability demand standardized testing and evaluation of the performance of the RF power delivery systems and control instrumentation on a chamber. Not only must the subsystems (i.e., the generator, cable assemblies, matching network, chuck/coil) be characterized, but the performance of the integrated system must also be characterized over the intended operating range.


It is the intent of this Standard to provide RF power delivery specifications for semiconductor processing equipment that leads to improved system and subsystem performance. It outlines performance criteria as well as required documentation that must be supplied with the system or subsystem components. The goal of the Document is to provide the specifications needed to produce a well-characterized RF power delivery system, where stability, repeatability, and important electrical parameters such as delivered power, current/voltage, and the impedance of the system can be determined within the operating space.


This Document specifies the minimum performance criteria for RF equipment used in the semiconductor industry. It does not address specific test methods or procedures for performance verification.


The primary focus for this Specification is semiconductor processing equipment including, but not limited to, the following tool types:

• Dry etch equipment, and

• Film deposition equipment (chemical vapor deposition [CVD] and physical vapor deposition [PVD]).


This Specification applies to semiconductor processing equipment RF power delivery systems whose power is directly used to produce and sustain the plasma.


Referenced SEMI Standards

SEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
SEMI E78 — Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment
SEMI E114 — Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems
SEMI E115 — Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems
SEMI E135 — Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems used in Semiconductor Processing Equipment
SEMI E136 — Test Method for Determining the Output Power of RF Generators Used in Semiconductor Processing Equipment RF Power Delivery Systems

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