SEMI E114 - Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems -

Abstract

The purpose of this Standard is to define a test method used to determine the electrical length, power losses, and characteristic impedance variation of RF cable assemblies used in RF power delivery systems for semiconductor processing equipment.

This Standard specifies the testing procedures and test equipment required for the following:

Determining the electrical length of RF cable assemblies at the nominal operating frequency in terms of degrees of phase shift.

Determining the power dissipation (loss) in the RF cable assembly at the nominal operating frequency.

Verifying the characteristic impedance of the RF cable assembly.

The primary focus for this Test Method is semiconductor processing equipment including, but not limited to, the following tool types:

Dry etch equipment, and

Film deposition equipment (chemical vapor deposition [CVD] and physical vapor deposition [PVD]).

This Standard does not address any safety or performance issues related to RF emissions or electrical codes (e.g., Underwriter’s Laboratory, Inc. (UL), the National Electrical Code (NECâ), Federal Communications Commission [FCC]). It is the responsibility of the users of this Standard to conform to the appropriate local codes and regulations as applied to this type of equipment, some of which are covered by Related Documents.

Referenced SEMI Standards (purchase separately)

None.

Revision History

SEMI E114-0302E (Reapproved 0923)

SEMI E114-0302E (Reapproved 0309)

SEMI E114-0302E (editorial revision)

SEMI E114-0302 (first published)

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