SEMI E115 - Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems
This Standard was technically approved by the Metrics Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 11, 2016. Available at www.semiviews.org and www.semi.org in August 2016; originally published March 2002; previously published March 2009.
The purpose of this Document is to define a test method used to determine the load impedance and efficiency of matching networks used in RF power delivery systems for semiconductor processing equipment.
This Document specifies the testing procedures and test equipment required for determining the load impedance and power efficiency of a matching network based on the positions of the tuning elements in the matching network.
The primary focus for this Test Method is semiconductor processing equipment including, but not limited to, the following tool types:
- Dry etch equipment,
- Film deposition equipment (CVD and PVD).
This Standard does not address any safety or performance issues related to RF emissions or electrical codes (e.g., Underwriter’s Laboratory, Inc. (UL), the National Electrical Code (NECâ ), Federal Communications Commission (FCC)). It is the responsibility of the users of this standard to conform to the appropriate local codes and regulations as applied to this type of equipment, some of which are covered by referenced documents.
Referenced SEMI Standards
SEMI E113 — Specification for Semiconductor Processing Equipment RF Power Delivery Systems
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