SEMI E119 - Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers -

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Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI E119-0706 (Reapproved 0512) - Inactive



NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.


NOTICE: This Document was reapproved with minor editorial changes.


This Standard partially specifies a reduced-pitch front-opening box for interfactory transport of 300 mm wafers (FOBIT). This reduced-pitch box, with a capacity of 25 wafers but with the approximate physical volume of a 13 wafer FOUP, is intended to reduce the cost of transporting wafers between IC manufacturing sites. To leverage current industry 300 mm technology, this reduced-pitch front-opening box is intended to interface with 13 wafer FIMS, as specified in SEMI E62.

This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the physical interfaces for FOBIT are specified; no materials requirements or micro-contamination limits are given. However, this Standard has been written so that both metal and injection-molded plastic FOBITs can be manufactured in conformance with it.


Referenced SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load Port

SEMI E47.1 — Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers

SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers

SEMI E62 — Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)

SEMI M1 — Specification for Polished Single Crystal Silicon Wafers

SEMI M31 — Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment


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