E13700 - SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南

Volume(s): Equipment Automation Hardware
Language: Chinese (Simplified)
Type: Single Standards Download (.pdf)
Abstract


NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version.

注意:个翻是一个参考版本。如果您在使用上,发现中文翻版本与英文原文版本生任何差异或是不确定之请务必参考英文原文版本,并以英文原文版本主,英文原文版本属于正式和权威的版本。

 

本文件的目的是了半体制造设备SME)在供商工厂装和包装、以及客室生区域的拆包和重新安置等特定活建立的指导标准。

 

准是了半体制造设备、独立的件和部件在供商工厂的装、包装以及从客货码头或接收区到高和超高纯应用的洁室生区的程而建立的指南。

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