E13700 - SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南

SEMI E137 - 半导体制造设备总装、包装、运输、拆箱和搬运指南 -

Member Price: $138.00
Non-Member Price: $180.00

Volume(s): Equipment Automation Hardware
Language: Chinese (Simplified)
Type: Single Standards Download (.pdf)
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Revision: SEMI E137-0705 (Reapproved 0118)E - Current

Revision

Abstract



NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version.

注意：这个翻译是一个参考版本。如果您在使用上，发现中文翻译版本与英文原文版本产生任何差异或是不确定之处，请务必参考英文原文版本，并以英文原文版本为主，英文原文版本属于正式和权威的版本。

 

本文件的目的是为了半导体制造设备（SME）在供应商工厂总装和包装、以及客户洁净室生产区域的拆包和重新安置等特定活动建立的指导标准。

 

本标准是为了半导体制造设备、独立的组件和部件在供应商工厂的总装、包装以及从客户装货码头或接收区到高纯和超高纯应用的洁净室生产区的转移过程而建立的指南。

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