SEMI E137 - Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Facilities Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2017. Available at www.semiviews.org and www.semi.org in January 2018; originally published November 2004; previously published November 2011.

 

E This Standard was editorially modified to make corrections that were approved outside of the normal reapproval process.

 

NOTICE: This Document was reapproved with minor editorial changes.

 

NOTICE: Paragraphs entitled ‘NOTE:’ are not an official part of this Standard or Safety Guideline and are not intended to modify or supersede the official Standard or Safety Guideline. These have been supplied by the global technical committee to enhance the usage of the Standard or Safety Guideline.

 

The objective of this Document is to establish standard guidelines for activities specific to the final assembly and packaging at the supplier’s facility, transportation, and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer’s cleanroom manufacturing area.

 

Referenced SEMI Standards

SEMI C41 — Specifications and Guidelines for 2-Propanol
SEMI E49.2 — Guide for the Qualification of Polymer Assemblies Used in Ultrapure Water and Liquid Chemical Systems in Semiconductor Process Equipment
SEMI F63 — Guide for Ultrapure Water Used in Semiconductor Processing

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