SEMI E142 - Specification for Substrate Mapping
This Document defines the data items that are required to report, store and transmit map data for substrates such as wafers, frames, strips and trays.
This version of the Document applies to the substrate types: wafers, frames, strips, and trays.
This Document addresses assembly and packaging including the testing of semiconductor devices.
Subordinate Standards (included)
SEMI E142.1 -1016 — Specification for XML Schema for Substrate Mapping
SEMI E142.2-1016 — Specification for SECS II Protocol for Substrate Mapping
SEMI E142.3-1016 — Specification for Web Services for Substrate Mapping
Referenced SEMI Standards (purchase separately)
SEMI E5 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E30 — Specification for Generic Model for Communication and Control of Manufacturing Equipment (GEM) – Event Data Collection and Dynamic Event Report Configuration
SEMI E39 — Specification for Object Services Standard: Concept, Behavior and Services
SEMI E39.1 — Specification for SECS II Protocol for Object Services Standard (OSS)
SEMI E40 — Standard for Processing Management
SEMI E90 — Specification for Substrate Tracking
SEMI E121 — Guide for Style and Usage of XML for Semiconductor Manufacturing Applications
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