SEMI E142 - Specification for Substrate Mapping

This Standard was technically approved by the Information & Control Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2016. Available at www.semiviews.org and www.semi.org in October 2016; originally published March 2005; previously published February 2011.

This Document defines the data items that are required to report, store and transmit map data for substrates such as wafers, frames, strips and trays.

This version of the Document applies to the substrate types; wafers, frames, strips and trays.

This Document addresses assembly and packaging including the testing of semiconductor devices.

Subordinate Standards:

SEMI E142.1 -1016 — Specification for XML Schema for Substrate Mapping

SEMI E142.2-1016 — Specification for SECS II Protocol for Substrate Mapping

SEMI E142.3-1016 — Specification for Web Services for Substrate Mapping

SEMI E5 — SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E30 — Generic Model for Communication and Control of Manufacturing Equipment (GEM) – Event Data Collection and Dynamic Event Report Configuration
SEMI E39 — Object Services Standard; Concept, Behavior and Services
SEMI E39.1 — SECS II Protocol for Object Services Standard (OSS)
SEMI E40 — Standard for Processing Management
SEMI E90 — Specification for Substrate Tracking

SEMI E121 — Guide for Style and Usage of XML for Semiconductor Manufacturing Applications