SEMI E166 - Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard
This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on June 17, 2014. Available at www.semiviews.org and www.semi.org in August 2014; originally published May 2013.
The purpose of this Standard is to ensure minimum necessary level of physical connectivity between the transport module and process modules comprising the cluster tool for 450 mm. It is expected that a process module can be connected to the transport module of any cluster tool with least design change provided that both modules meet the requirement of this Standard.
Process modules accept wafers at locations that may vary substantially from one module to another. This places a burden on the capabilities of transport modules to move wafers to and from various process modules in a cluster tool. This Specification defines wafer transport planes within modules. This obviates the wafer transport problem to a large extent, but does not unduly restrict process module content.
This Standard defines the interface plane between modules in a cluster tool. It provides the mechanical specifications at the interface between the transport module and process module to be connected together; no requirements are imposed on the module content.
This Standard is applicable only to wafers that are 450 mm in diameter and to the interface between cluster tool modules, with the following exception. The transport module operates across the interface plane; thus, a definition of the wafer transport plane within process modules is required.
Referenced SEMI Standards
SEMI E21 — Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard
SEMI E21.1 — Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard
SEMI E154 — Mechanical Interface Specification for 450 mm Load Port