SEMI E174 - Specification for Wafer Job Management (WJM)

Volume(s): Equipment Automation Software
Language: English
Type: Single Standards Download (.pdf)
Abstract

The purpose of this Standard is to provide a communication method which observes and/or controls every single wafer (including its related information) on equipment individually (and independently rather than a member of a lot) through single management point from the host.

 

The purpose of this Standard is to introduce Wafer Job (WJ) in order to observe and/or control a wafer (and its information including context information from related actions such as pre-processing, processing, and post-processing steps) in the equipment independently.

 

The purpose of this Standard is to provide Wafer Job Object (WJOBJ) model so that the information that should be managed in conjunction with the WJ can be encapsulated in the object and can be accessed from the host.

 

The purpose of this Standard is to introduce Wafer Flow Job (WFJ) in order to manage multiple WJs in the equipment.

 

The purpose of this Standard is to provide Wafer Flow Job Object (WFJOBJ) model so that the information that should be managed in conjunction with the WFJ can be encapsulated in the object and can be accessed from the host.

 

The scope of this Standard is to define WJOBJ which represents WJ.

 

The scope of this Standard is to define WFJOBJ which represents WFJ.

 

The scope of this Standard is to define related functionalities which support WJ and/or WFJ.

 

This Standard mainly focuses on product wafer, however does not exclude non-product wafers.

 

Referenced SEMI Standards

SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)

SEMI E39 — Specification for Object Services Standard: Concepts, Behavior, and Services

SEMI E40 — Specification for Processing Management

SEMI E40.1 — Specification for SECS-II Support for Processing Management

SEMI E87 — Specification for Carrier Management (CMS)

SEMI E90 — Specification for Substrate Tracking

SEMI E94 — Specification for Control Job Management

SEMI E118 — Specification for Wafer ID Reader Communication Interface – The Wafer ID Reader Functional Standard: Concepts, Behavior and Service

SEMI E133 — Specification for Automated Process Control Systems Interface

SEMI E142 — Specification for Substrate Mapping

SEMI E157 — Specification for Module Process Tracking

SEMI E170 — Specification for Secured Foundation Of Recipe Management System (SFORMS)

SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

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