SEMI E181 - Specification for Panel FOUP for Panel Level Packaging -

Abstract

1  Purpose
1.1  The purpose of this Specification is to establish basic physical dimensions for the Panel FOUP intended to be used to transport and store panels, as specified by SEMI 3D20 for 510 mm × 515 mm panel size and 600 mm × 600 mm panel size.
1.2  This Specification is intended to define the reference planes for the dimensions of the Panel FOUP and the panel load port.
1.3  This Specification is intended to define a set of requirements to ensure interoperability of load ports and Panel FOUP without limiting innovative solutions.
2  Scope
2.1  This Standard specifies the external features and dimensions of the Panel FOUP; however, individual dimensions related to panel size and number of stored panels are specified by the Subordinate Standards.
2.2  This Standard specifies the interior exclusion volumes for supporting and restraining panels in the Panel FOUP, however, individual dimensions related to panel size and number of stored panels are specified by the Subordinate Standards.
2.3  This Standard defines three orthogonal reference planes as references for Panel FOUP dimensions.
NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

Subordinate Standards (included)
SEMI E181.1 — Specification for Panel FOUP for 510 mm to 515 mm Panel Size and 12 Slots
SEMI E181.2 — Specification for Panel FOUP for 510 mm to 515 mm Panel Size and 6 Slots
SEMI E181.3 — Specification for Panel FOUP for 600 mm to 600 mm Panel Size and 12 Slots
SEMI E181.4 — Specification for Panel FOUP for 600 mm to 600 mm Panel Size and 6 Slots

Referenced SEMI Standards (purchase separately)
SEMI 3D20 — Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications
SEMI E144 — Specification for RF Air Interface Between RFID Tags in Panel FOUP and RFID Reader in Semiconductor Production and Material Handling Equipment
SEMI E182 — Specification for Panel FOUP Load Port for Panel Level Packaging
NOTE 1: The SEMI Physical Interfaces & Carriers Global Technical Committee is developing a Specification for Panel FOUP Load Ports intended to be used in conjunction with this Standard.
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

Revision History
SEMI E181-0526 (technical revision)
SEMI E181-0424 (technical revision)
SEMI E181-0423 (technical revision)
SEMI E181-0222 (technical revision)
SEMI E181-0321 (first published)

SEMI E181.1-0526 (technical revision)
SEMI E181.1-0424 (technical revision)
SEMI E181.1-0423 (technical revision)
SEMI E181.1-0222 (technical revision)
SEMI E181.1-0321 (first published)

SEMI E181.2-0526 (technical revision)
SEMI E181.2-0424 (technical revision)
SEMI E181.2-0423 (technical revision)
SEMI E181.2-0222 (technical revision)
SEMI E181.2-0321 (first published)

SEMI E181.3-0526 (technical revision)
SEMI E181.3-0424 (technical revision)
SEMI E181.3-0423 (technical revision)
SEMI E181.3-0222 (technical revision)
SEMI E181.3-0321 (first published)

SEMI E181.4-0526 (technical revision)
SEMI E181.4-0424 (technical revision)
SEMI E181.4-0423 (technical revision)
SEMI E181.4-0222 (technical revision)
SEMI E181.4-0321 (first published)

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