SEMI E182 - Specification for Panel FOUP Load Port for Panel Level Packaging -

Abstract

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1  Purpose
1.1  The purpose of this Specification is to define the basic interface dimensions of a load port on the semiconductor manufacturing equipment (SME), where a Panel FOUP can be loaded and unloaded. The intention of this Specification is to define a set of requirements and features to enable interoperability of load ports and Panel FOUPs without limiting innovative solutions.
2  Scope
2.1  Since the interface specification in this Standard is driven by and intended to connect with a Panel FOUP compliant to the relevant SEMI Panel FOUP Standards, individual dimensions related to panel size are specified by the applicable Subordinate Standard of this Primary Standard.
2.2  Loading and unloading is assumed to take place in semi-automated and automated mode by using appropriate system or device (e.g., person guided vehicle or overhead hoist vehicle).
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Subordinate Standards (included)
SEMI E182.1 — Specification for Panel FOUP Load Port for 510 mm to 515 mm Panel Size
SEMI E182.2 — Specification for Panel FOUP Load Port for 510 mm to 515 mm Panel Size
SEMI E182.3 — Specification for Panel FOUP Load Port with Ground Based Delivery Exclusion Volume

Referenced SEMI Standards (purchase separately)
None.
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

Revision History
SEMI E182-0326 (technical revision)
SEMI E182-0925 (technical revision)
SEMI E182-0424 (technical revision)
SEMI E182-0723 (technical revision)
SEMI E182-0621 (first published)

SEMI E182.1-0621 (Reapproved 0326)
SEMI E182.1-0621 (Reapproved 0925)
SEMI E182.1-0621 (Reapproved 0424)
SEMI E182.1-0621 (Reapproved 0723)
SEMI E182.1-0621 (first published)

SEMI E182.2-0621 (Reapproved 0326)
SEMI E182.2-0621 (Reapproved 0925)
SEMI E182.2-0621 (Reapproved 0424)
SEMI E182.2-0621 (Reapproved 0723)
SEMI E182.2-0621 (first published)

SEMI E182.3-0326 (first published)

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